Whisker Test of Lead-Free Semiconductor Packages in Lead-Free Soldering

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Lead-free Soldering Effect on Tantalum Capacitors

Legislation is being developed worldwide to reduce the lead content in many consumer electronic products. This is being taken as an action to reduce environmental impact when such products are discarded. Despite the fact that lead containing solders in electronic assemblies account for only 0.49% of world lead consumption, the trend in legislation will likely be to require not only reduced lead...

متن کامل

Lead-Free Selective Soldering: The Wave of the Future

The European perspective on waste management and recycling as described in the European Union’s Waste of Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (ROS) strongly suggests that lead-free electronic assemblies will be mandatory in Europe by 2008. Japan is moving toward voluntary compliance by 2003 with a lead-free initiative that focuses on environmental m...

متن کامل

Lead-Free Soldering – Where The World Is Going

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...

متن کامل

LEAD-FREE BNKT PIEZOELECTRIC ACTUATOR

An actuator is a device that converts input energy into mechanical energy. According to various types of input energy, various actuators have been advanced. Displacement in the electromagnetic, hydraulic and pneumatic actuators achieve by moving a piston via electromagnetic force or pressure, however the piezoelectric actuator (piezoceramic plates) displace directly. Therefore, accuracy and spe...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Journal of Japan Institute of Electronics Packaging

سال: 2010

ISSN: 1343-9677,1884-121X

DOI: 10.5104/jiep.13.71